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Automatic Printer
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Base size :458mm(L)X356mm(W)大50mm(L)X50 mm(W)
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Min speed: 1~300mm/s
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Accuracy: ±0.025mm
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SMT
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Speed: 40000cpH 0.09Second
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PCB size: 460(L) x 400(W) 510(L) x 460(W) (Optional), 610(L) x 510(W)(Optional), 740(L) x 460(W)(Optional)
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Size: Min 0201, Max30X30inch
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Blow height 25.4mm
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PCB thickness: 0.38-4.2mm
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SMT capacity: 3Million welding spot/day
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Base type: POP/Board/FPC/Rigid-Flex/Metal base
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Attrition rat: Resistor-Capacitor 0.3%, IC 0%
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Accuracy: ±0.04mm
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Reflow oven
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PCB max width: 270mm×2(Single channel 50-490mm)
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Heating time: 30mins
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Temperature: room -300°C
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Speed: 300-2000mm/min
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Fault warning: low or high temperature, voice or light warning
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Heat/cool zone: Up 10\down 10 heating zone, up 2 cooling zone
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Reflow: lead solder, lead free solder
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AOI
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PCB size: 450mm(L)X400mm(W) , big 50mm(L)X50mm(W). Min thickness:1mm~3mm
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FOV/Resolution: 4Megan Pixels FOV:37.237.2mm Resolution:18.2um/pixel
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Speed: 4.940mX4.940m/Sec
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Min: 0201chip/0.4pitch IC(mm)
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Wave soldering machine
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Pre heating: below15mins
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Temperature: room -280°C
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PCB width:50~350mm
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Base bottom space: Up 120mm, Down 25mm
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Speed: 0-1800mm/min
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Pre heating No. & method :3 bottom hot wind pre heating
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Temperature control of pre heating: PID closed loop control+SSR drive
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Control method: Auto computer control, Windows7
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Spray system: built-in air-blast atomizer
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Transport claw: titanium alloy double claw
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Solder pot running method: mechanical
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Cooling method: Air cooling
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